Electronics print chhuah a ni.
Precision plasma surface treatment chu printed electronics & flexible devices te tan a ni.
Advanced Plasma Surface Treatment hian sensitive substrate-a hman tur adhesion rintlak a siam thei a, chu chu:
- Conductive ink bonding atana polyimide (PI) leh PET film te tihchak theihna tur flexible printed circuits (FPCs)-
- OLED/LCD hian Ultra-Lamination hmanga Glass (UTFG) leh ITO coatings te a entir a, hei hi a la awm reng a ni.
- Thin-film battery - Li-ion electrode foils te chu a chungah a awm a.
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Chona |
Plasma hmanga chinfel theih a ni. |
Technical lama hlawkna . |
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Surface energy hniam tak tak polymer te . |
Oxygen/argon/plasma ah hian hydroxyl ({{0}OH) & carboxyl (-COOH) group hrang hrang a rawn lut a. |
Contact angle tihhniam chu 80℃→30℃atanga 1000 a ni.<1s |
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Discharge-sensitive materials . |
Pulsed DBD plasma at .<50°C prevents thermal damage |
Nanoscale siam danglamna (a siam danglamna (<10nm depth) only |
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UTFG-a adhesion a chhiat chuan . |
DCSBD Plasma hian hydrocarbons a paih chhuak a, chutih rualin oxygen functionalities a belhchhah bawk. |
105× RGO circuit-a resistivity tihtlem . |
Material-Protocol hrang hrang a awm .
- Polyimide film siam (Kapton®) .
Process: n20kHz-ah n20k, 7kv
Result: 60% ink adhesion leh Corona enkawlna a sang zawk
- ULTRA-Thiltihtheihna 100 (UTFG) .
Process: Diffuse coplanar surface barrier discharge (DCSBD) .
Result: PEDOT:PSS coatings ah hian 40% conductivity a sang a ni.
- LI-ION Electrode chuan a ti a.
Process: Atmospheric Plasma leh He/O2 Mix .
Result: laminated cell-a peel chakna 15% a sang zawk
- Engineer-A chhuahna tur atana solution awm thei-sensitive materials .
Kan system te hian real-time impedance monitoring leh adaptive power control te chu arcing on loh nan a thlunzawm a ni.
Temperature-sensitive bio-polymers (eg, PLGA scaffolds)
Micro-Ito lei chung lam chu a hrual a.
Battery hrang hranga inhmeh tak tak te pawh a awm bawk.
- Kan Surface Engineering team te hi biak theih reng kan ni e:
▶︎ Material nena inmil testing report (WCA/SEM/XPS data telh)
▶︎ I substrate hmanga process validation (PI/COP/PEN) .
▶︎ on-Site parameter optimization a ni a, discharge a chhiat loh nan