Paper leh cardboard .

Multi- Layer Paper & Cardboard Lamination tan plasma lei chunglam enkawlna a ni.

Low-Temperature plasma treatment hi dry process tha tak a ni a, chu chuan multi-material laminated products (eg, paper{4}}cardboard-plastic composites)-a interlayer adhesion a tichak a ni. Surface energy siam danglam a, nanoscale roughness siam hian plasma hian substrate surface te chu bulk property tihdanglam lovin a tichak a ni. Hei hian consimilar layers (eg, coatings, films, or bio-based barriers) inkara inzawmna nghet tak a siam thei a, chutih rualin environment tichhe thei adhesives, primers, leh solvents te chu 100% thleng a tihtlem a, chu chu thil siamna process-ah a ni.

A pawimawh ber chu plasma technology hian production line a huam zau hle. Post-processing stages-ah chuan adhesion chu a ti tha hle a, chungte chu:

• Printing ink leh anti-counterfeiting coatings te pawh a awm bawk.
• Tui-Thawhrimna tawk thei (eg, fluorination atana SF₆ plasma)
• Eco-Coatings tha tak tak (eg, plant-oil-based hydrophobic layers)
• UV-Adhesives leh recyclable sealant tihdam theih loh .